PC30 Ch5 Memory+Processors Glossary

  1. CAS Latency
    A method of measuring access timing to memory, which is the number of clock cycles required to write or read a column of data off a memory module. CAS stands for Column Access Strobe. Compare to RAS Latency.
  2. DDR
    See Double Data Rate SDRAM.
  3. DIMM
    (dual inline memory module) A miniature circuit board installed on a motherboard to hold memory. DIMMs can hold up to 16 GB of RAM on a single module.
  4. (DDR SDRAM
    Double Data Rate SDRAM (DDR SDRAM) A type of memory technology used on DIMMs that runs at twice the speed of the system clock. Also called DDR SDRAM, SDRAM II, and DDR.
  5. double-sided
    A DIMM feature whereby memory chips are installed on both sides of a DIMM.
  6. dual channels
    A motherboard feature that improves memory performance by providing two 64-bit channels between memory and the chipset. DDR, DDR2, and DDR3 DIMMs can use dual channels.
  7. dual processors
    Two processor sockets on a server motherboard.
  8. dual ranked
    Double-sided DIMMs that provide two 64-bit banks. The memory controller accesses first one bank and then the other. Dual-ranked DIMMs do not perform as well as single-ranked DIMMs.
  9. DRAM
    dynamic RAM (DRAM) The most common type of system memory, it requires refreshing every few milliseconds.
  10. ECC
    (error-correcting code) A chipset feature on a motherboard that checks the integrity of data stored on DIMMs or RIMMs and can correct single-bit errors in a byte. More advanced ECC schemas can detect, but not correct, double-bit errors in a byte.
  11. GPU
    graphics processing unit (GPU) A processor that manipulates graphic data to form the images on a monitor screen. A GPU can be embedded on a video card or on the motherboard or integrated within the processor.
  12. Hyper-Threading
    The Intel technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. (HyperTransport- The AMD technology)
  13. HyperTransport
    The AMD technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. (Hyper-Threading -The Intel technology)
  14. L1 Cache
    Level 1 cache (L1 cache) Memory on the processor die used as a cache to improve processor performance.
  15. L2 Cache
     Level 2 cache (L2 cache) Memory in the processor package but not on the processor die. The memory is used as a cache or buffer to improve processor performance. Also see Level 1 (L1) cache.
  16. L3 Cache
     Level 3 cache (L3 cache) Cache memory further from the processor core than Level 2 cache, but still in the processor package.
  17. memory bank
    The memory a processor addresses at one time. Today’s desktop and notebook processors use a memory bank that is 64 bits wide.
  18. multi-core processing
    A processor technology whereby the processor housing contains two or more processor cores that operate at the same frequency but independently of each other.
  19. multiplier
    The factor by which the bus speed or frequency is multiplied to get the CPU clock speed.
  20. multiprocessing
    Two processing units installed within a single processor and first used by the Pentium processor.
  21. multiprocessor platform
    A system that contains more than one processor. The motherboard has more than one processor socket and the processors must be rated to work in this multiprocessor environment.
  22. processor frequency
    The frequency at which the CPU operates. Usually expressed in GHz.
  23. quad channels
    Technology used by a motherboard and DIMMs that allows the memory controller to access four DIMMS at the same time.
  24. RAS Latency
    A method of measuring access timing to memory, which is the number of clock cycles required to write or read a row of data off a memory module. RAS stands for Row Access Strobe. Compare to CAS Latency.
  25. SDRAM II
    See Double Data Rate SDRAM.
  26. single channel
    The memory controller on a motherboard that can access only one DIMM at a time. Compare to dual channel and triple channel.
  27. single-sided
    A DIMM that has memory chips installed on one side of the module.
  28. SO-DIMM
    (small outline DIMM) A type of memory module used in notebook computers that uses DIMM technology. A DDR3 SO-DIMM has 204 pins. A DDR2 or DDR SO-DIMM has 200 pins. Older, outdated SO-DIMMs can have 72 pins or 144 pins.
  29. SRAM
    static RAM (SRAM) RAM chips that retain information without the need for refreshing, as long as the computer’s power is on. They are more expensive than traditional DRAM.
  30. thread
    Each process that the CPU is aware of; a single task that is part of a longer task or program.
  31. triple channels
    When the memory controller accesses three DIMMs at the same time. DDR3 DIMMs support triple channeling.
  32. x86 processor
    An older processor that first used the number 86 in the model number and processes 32 bits at a time.
  33. x86-64 bit processor
    Hybrid processors that can process 32 bits or 64 bits.
Author
Anonymous
ID
318099
Card Set
PC30 Ch5 Memory+Processors Glossary
Description
PC30 Ch5 Memory+Processors Glossary
Updated