Neets Module 14 Assignment 1

  1. What problems were evident about military electronic systems during World War II?
    • Size
    • Weight
    • Power consumption.
  2. What discovery opened the door to solid-state electronics?
    The transistor and solid-state diode.
  3. What is microelectronics?
    Technology of electronic systems made of extremely small electronic parts or elements.
  4. What discovery proved to be the foundation for the development of the vacuum tube?
    The Edison Effect.
  5. Name the components which greatly increase the weight of vacuum-tube circuitry.
    • Transformers
    • Capacitors
    • Resistors.
  6. What are the disadvantages of point-to-point wiring?
    "Rat's nest" appearance and unwanted interaction, such as capacitive and inductive effects.
  7. What is a major advantage of modular construction?
    Rapid repair of systems and improved efficiency.
  8. When designing vacuum-tube circuits, you must take what characteristics of tubes into consideration?
    Differences in performance of tubes of the same type.
  9. List the major advantages of printed circuit boards.
    Eliminate heavy chassis and point-to-point wiring.
  10. What is the major disadvantage of printed circuit boards?
    Components soldered in place.
  11. The ability to place more components in a given space is an advantage of the _______.
    Cordwood module.
  12. Define integrated circuit.
    Elements inseparably associated and formed in or on a single substrate.
  13. What are the three major types of integrated circuits?
    • Monolithic
    • Film
    • Hybrid.
  14. How do monolithic ICs differ from film ICs?
    Monolithic ICs contain active and passive elements. Film ICs contain only passive elements.
  15. What is a hybrid IC?
    Combination of monolithic ICs and film components.
  16. How many logic gates could be contained in lsi?
    1,000 to 2,000.
  17. What are the basic steps in manufacturing an IC?
    Circuit design, component placement, suitable substrate, and depositing proper materials on substrate.
  18. Computer-aided layout is used to prepare _______ devices.
  19. What purpose do masks serve?
    Control patterns of materials on substrates.
  20. What type of substrates are used for film and hybrid ICs?
    Glass or ceramic.
  21. Describe the preparation of a silicon substrate.
    Crystal is sliced into wafers. Then ground and polished to remove any surface defect.
  22. Name the two types of monolithic IC constructions.
    • Diffusion
    • Epitaxial growth.
  23. How do the two types of monolithic IC construction differ? (Diffusion and Epitaxial growth)
    Diffusion penetrates substrate; epitaxial does not.
  24. What is isolation?
    Electrical separation of elements.
  25. What methods are used to deposit thin-film components on a substrate?
    Evaporation and cathode sputtering.
  26. How are thick-film components produced?
  27. What is a hybrid IC?
    Combination of monolithic and film elements.
  28. What is the primary advantage of hybrid circuits?
    Circuit flexibility.
  29. What is the purpose of the IC package?
    Protect the IC from damage; make handling easier.
  30. What are the three most common types of packages?
    • TO
    • Flat pack
    • DIP.
  31. What two methods of manufacture are being used to eliminate bonding wires?
    • Flip-chip
    • Beam lead.
  32. On DIP and flat-pack ICs viewed from the top, pin 1 is located on which side of the reference mark?
  33. DIP and flat-pack pins are numbered consecutively in what direction?
  34. Viewed from the bottom, TO-5 pins are coumted on what direction?
  35. The numbers and letters on ICs and schematics serve what purpose?
    Identify the type of IC.
  36. Standardized terms improve what action between individuals?
  37. Microcircuit refers to any component containing what types of elements?
    Integrated circuits.
  38. Components made up exclusively of discrete elements are classified as what type of electronics?
  39. Resistors, capacitors, transistors, and the like, are what level of packaging?
    Level 0.
  40. Modules or submodules attached to a mother board are what packaging level?
    Level I.
  41. What is the packaging level of a pcb?
    Level II.
  42. What are the three most common methods of interconnections?
    • Conventional printed circuit boards
    • Multilayer printed circuit boards
    • Modular assemblies.
  43. Name the three methods of interconnecting components in multilayer printed circuit boards.
    • Clearance hole
    • Plated-through hole
    • Layer build-up.
  44. What is one of the major disadvantages of multilayer printed circuit boards?
    Difficulty of repair of internal connections.
  45. What was the earliest form of micromodule?
    Cordwood modules.
  46. In what publication are environmental requirements for equipment defined?
    Procurement specifications.
  47. In what publication would you find guidelines for performance of military electronic parts?
    Military Standards.
  48. Who is responsible for meeting environmental and electrical requirements of a system?
    Equipment designers (planners).
  49. What methods are used to prevent unwanted component interaction?
    • Ground planes
    • Shielding
    • Component placement.
Card Set
Neets Module 14 Assignment 1